Design Services
Nexchip design service function has been built up from the beginning of 2018. We aim at providing full specific design flow to customers, and speeding up  product tape out for market penetration. Design service at Nexchip not only  supports 150nm、110nm、90nm technology node but also towards more advanced 55nm   technology node. The specific design service includes: PDK、technology files、   device model、third party IP and library,Tape Out service,MWP. We will support   customers with the full IC design flow.
Regarding to PDK and technology file, 150nm technology PDK supports 1.8V/18V、3.3V/18V and 3.3V/13.5V process .  110nm technology PDK supports 110N 1.5V/6V/32V、110N2 1.5V/6V/32V、110M 1.2V/6V/32V related platform, also providing 1.5V/5V and 1.2V/3.3V related logic+flash platform PDK. For detailed technology nodes, see the [Technology Roadmap].
Nexchip collaborates with high quality third party IP vendors to provide all kinds of IPs,including foundation IP、 High Speed Interface IP、Mixed-Signal Analog IP、NVM and Memory Interface IP . At present,  STD cell、SRAM Complier、 OTP、MTP and eFlash are available for  150nm/110nm/90nm technologies. Various kinds of IPs will be available for 55nm  technology in the future.
3、Tape out
4、Design Platform Ecosystem


5. MPW
Nexchip provides MPW(shuttle) service for customer to penetrate market rapidly.   Customers can verify the prototype design by silicon as soon as possible, and  strive for leading market opportunities. Currently, Nexchip shuttle plan is available  on the table. If there is a request, please kindly contact sales for details.

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